Joseph KavetskyIntel Corp. and United Microelectronics Corporation, a prominent global semiconductor foundry, have announced a collaboration to develop a 12-nanometer semiconductor process platform targeting high-growth markets like mobile technology, communication infrastructure, and networking.
The new process node will be developed and manufactured in Fabs 12, 22 and 32 at Intel’s Ocotillo Technology Fabrication site in Chandler. Intel says that utilizing existing equipment in these fabs will significantly reduce initial investment requirements and enhance operational efficiency.
Production of the 12 nm process is anticipated to commence in 2027.
The new collaboration between Intel and UMC will provide global customers with new options for accessing semiconductors across different geographical locations beyond Taiwan.
“Intel’s strategic collaboration with UMC further demonstrates our commitment to delivering technology and manufacturing innovation across the global semiconductor supply chain and is another important step toward our goal of becoming the world’s second-largest foundry by 2030,” said Stuart Pann, Intel senior vice president and general manager of Intel Foundry Services.
Production will benefit from UMC’s extensive process leadership over decades and its track record of offering customers Process Design Kit (PDK) and design support to effectively deliver foundry services.
“This effort will enable our customers to smoothly migrate to this critical new node, and also benefit from the resiliency of an added Western footprint,” UMC Co-President Jason Wang said. “We are excited for this strategic collaboration with Intel, which broadens our addressable market and significantly accelerates our development roadmap leveraging the complementary strengths of both companies”
Both companies will collaborate to meet customer demand and support the 12 nm process by facilitating electronic design automation and intellectual properties solutions from ecosystem partners.
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